Dicing Solutions
Cleaning Solutions
Bonding Solutions
Adhesives
Vision care
Barcode, Labels, Stickers, ribbon
Our vast dicing knowledge with over 40 years of experience combined with the latest blade design and state-of-the-art manufacturing facilities can challenge any new application & material dicing requirement.
Our worldwide application labs located close to our customers’ sites are equipped with the latest saw systems, peripheral equipment, and quality measurement tools to provide a tailor-made solution to any demanding customer requirement.
ExBond chip adhesive and electronic assembly adhesive developed by Benno have been widely used in the electronic packaging market. Both product performance and product stability have excellent performance.
Relying on an internationally advanced technology platform with independent intellectual property rights, Bennuo Company has effectively solved the contradiction between bonding performance and application performance, breaking through the market situation that had previously been occupied by foreign brands, and has become a well-known brand of domestic electronic grade adhesives.
As technological applications become increasingly complex, so do the printed circuit boards that power them. Today, PCBs can do more while utilizing less space through the implementation of the following:
AMC CO., LTD has been developing, manufacturing, and supplying tape for semiconductors.
AMC has been stretching himself as a worldwide semiconductor tape maker by developing and manufacturing excellent base film, and adhesive both nominally and virtually.
ZEISS Semiconductor Manufacturing Company is the global technology leader in the production of systems and modules for microchip production. With semiconductor manufacturing optics, photomask systems, and process control solutions, ZEISS supplies key technologies for the production and metrology of ultra-fine semiconductor structures on silicon wafers – the raw material used to make microchips. Advances in computer technology largely rely on the ongoing development of optical lithography – every new generation enables even finer structures to be produced on the microchips. This makes circuits more compact, resulting in more powerful and more energy-efficient microchips every year.
ZEISS has been driving the development of semiconductor manufacturing technology right from day one. The company’s new and unique extreme ultraviolet (EUV) lithography has created a series of further generations of microchips with ever greater integration density.
